The ability to jet liquid materials that have viscosities in excess of 20 centipoises has opened a new level of packaging miniaturization. Display components such as OLEDs, PLEDs, topside emission OLEDs, high definition LCOS and DLP chips utilize UV adhesives, liquid crystal, desiccants and conductive adhesives in high accuracy and minute quantities. Jetting underfill for semiconductor packaging provides high throughput with small keep-out areas enabling cost effective flip chip assembly in FCIP assembly. The unique ability of jetting small streams at high flow rates has enabled cell phones to pass drop tests with package on package (PoP) assembly and enabled through shield application of CSP underfill material for low cost, re-workable assembly. This paper will cover the enabling applications of jetting materials that have led to new and cost effective assembly solutions. Read the full article (PDF)...

This article was taken from Global SMT & Packaging Vol. 7 No. 4 - April 2007. This paper was originally presented at Pan Pacific, Hawaii, 2007.

Keywords : jetting, semiconductor packaging, electronic component packaging, adhesives, display technology

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