BAE Systems has improved flow time, increased processing flexibility, reduced costs and maintained a low defect rate through implementation of a new soldering technology. This paper addresses their elimination of a vapor phase soldering system and the associated processing steps necessary to solder two-sided connector boards using selective soldering. It also discusses how processing flexibility has improved by transferring complicated mixed technology boards from wave solder to selective solder by incorporating a dual reflow process. The ultimate goals of implementing dual reflow and selective solder were to positively affect the bottom line and to increase customer satisfaction. Read the full article (PDF)...

This article was taken from Global SMT & Packaging Vol. 7 No. 2 - February 2007

Keywords : John Weisheit, Tom Barnard

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