Global SMT RSS feed
No comment posted mXcomment 1.0.9 © 2007-2010 - visualclinic.fr License Creative Commons - Some rights reserved Related ItemsNo related items |
 Featured Interview
Small Matters
Lead-Free Matters
 Global Business
Industry BlogsKeep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff |
|||||||||||||||||||||||||||||||||
BAE Systems has improved flow time, increased processing flexibility, reduced costs and maintained a low defect rate through implementation of a new soldering technology. This paper addresses their elimination of a vapor phase soldering system and the associated processing steps necessary to solder two–sided connector boards using selective soldering. It also discusses how processing flexibility has improved by transferring complicated mixed technology boards from wave solder to selective solder by incorporating a dual reflow process. The ultimate goals of implementing dual reflow and selective solder were to positively affect the bottom line and to increase customer satisfaction. 
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010. 