This paper details the experience of one medium sized assembler set on achieving a customer-driven mandate to go lead-free for the assembly of high-end printer boards. Using both tin-silver-copper and tin-copper, both production yields and quality were maintained. Over 120,000 builds were achieved with no soldering defects. SAC305 was used for the reflow process and tin-copper-nickel (SnCu) based solder K100 was used in the wave soldering operation and for hand assembly. Read the full article (PDF)...

This article was taken from Global SMT & Packaging Vol. 7 No. 2 - February 2007

Keywords : Peter Biocca, Carlos Rivas, SAC305, SnCu-based solders, lead-free, RoHS, contract assembly

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