| Posted by Global SMT & Packaging on 06 March 2007 at 15:14
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The International Wafer-Level Packaging Conference has issued a "Call for Papers" for its fourth annual program, scheduled for September 17-19 at San Jose’s Wyndham Hotel.
Opening day, September 17, will be devoted to specialty workshops presented by industry experts. September 18-19 will feature general business and technical sessions on wafer-level packaging, 3D/stacked packaging and test.
Some 50 company exhibits will also be present from Sept. 18-19, with companies that supply materials, products and services to the semiconductor packaging and test industries.
Conference co-chairs have requested a minimum of 200-word abstracts with proposed topics. The abstracts should be submitted before April 10 to Melissa Serres at melissa@smta.org.
Dr. Ken Gilleo of ET-Trends LLC, who is also SMTA’s vice president of technical programs, and Terry Thompson, senior editor of Chip Scale Review will again co-chair the technical program.
The Conference will explore many topics in wafer-level packaging, 3D/stacked packaging and other advanced areas. Full details may be found at http://www.smta.org/iwlpc
The IWLPC is co-presented by the industry’s leading association, SMTA, and Chip Scale Review magazine. |
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