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6.4 - April 2006
 

Posted by Global SMT & Packaging on 03 April 2006 at 00:00


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Issue 6.4 / April 2006

- Editorial -

Where is the world taking us?
Trevor Galbraith

- Technology Focus -

Single ball reballing and repair of BGA components
Robert V. Avila

Maximizing the 'value-add' of the electronic materials partner
George A. Toskey

Fact and fiction of lead-free soldering
Keith Sweatman

Why solder spikes form
Yoshinobu Anbe


- Special Features -

George Szekeley Interview - TYCO Electronics

- Regular Columns -

Stencil board options and board wash-offs (European edition)
Bob Willis

The unaccounted cost of the lead-free mandate
Joe Fjelstad

Clear signs of normal seasonal slowdown
Jon and Walt Custer

Further study needed on backward compatability
Dongkai Shangguan


- Other regular features -

Industry news
Appointments
Association news
International diary

 

   
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Keywords : Trevor Galbraith, APEX, jetting, small dots, high viscosity, packaging, Alec J. Babiarz, Printing, Dr Peter Harrop, Global Technology Awards, Pat Flynn, Interview, Design, global outsourcing, Dongkai Shagguan, System design, Joe Fjelstad, Solder spots, Bob Willis, market, Jon Custer, Walt Custer, Reliability, underfills, Werner Engelmaier


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