Global SMT & Packaging magazine - 7.1  Pat Trippel Interview

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7.1 – Pat Trippel Interview

Posted by Global SMT & Packaging on 07 February 2007 at 16:10

Electronics materials manufacturers need to stay close to their customers, both technically and geographically. Global SMT & Packaging editor Trevor Galbraith spoke to Henkel electronics group president Pat Trippel about the constant challenges facing materials suppliers in a fast-paced manufacturing world. Read the full interview (PDF)...

This interview was taken from Global SMT & Packaging Vol. 7 No. 1 - January 2007

Keywords : Pat Trippel, interview, Henkel

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