This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes. Finite element method simulation was used to calculate the stress profile with different packaging materials and different packaging geometries. After simulation, a silicon test chip was fabricated to validate the simulation results. A network of piezo-resistive solid state resistors created by diffusion was used to measure the surface tension pattern between adjacent membranes. The sheet resistance was measured using a high precision modular resistance meter. Read the full article (PDF)...

This article was taken from Global SMT & Packaging Vol. 7 No. 1 - January 2007

Keywords : mechanical stress, MEMS, MEMS sensor, MEMS actuator

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