IPC–Association Connecting Electronics Industries® has issued a call for participation for the inaugural event of IPC Midwest Conference & Exhibition, September 25–28, 2007, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to get in on the ground floor by submitting an abstract for the technical conference with focus on all aspects of electronics manufacture — board design and manufacture, electronics assembly, and test. The Technical Conference will be held September 26–28, 2007. 

Expert presentations are being sought on all relevant electronics manufacture subjects, including: Lead Free Implementation — printed board solderability, solder joint reliability, tin whiskers; Board Design — embedded passives, advances in CAD/CAM, fine pitch design; Board Materials — new laminates, materials testing, high frequency laminates; Board Fabrication — advances in plating technology, advances in flex and rigid-flex, via fill technology; and Assembly Technology — BGA attachment reliability, rework and repair, no clean processes. Abstracts must be submitted by April 18, 2007.

IPC has a 50-year history of presenting the latest developments in technology in the electronic interconnection industry. Time and time again, IPC has delivered a strong, technical savvy audience for technical paper authors. “We don’t throw up technical presentations to enhance our event. We create and craft a technical conference that enhances our industry’s learning,” David Bergman, IPC vice president of standards, explained. 

Professional development courses will also be offered September 25–28. 2007.  Proposals are solicited from individuals interested in teaching full-day or half-day courses on design, printed circuit board and electronic manufacturing processes and materials. Proposals including course descriptions must be submitted by April 18, 2007. 

For more information on abstract and proposal submissions, visit www.IPCMidwestShow.org or contact Alexandra Curtis at +1 847-597-2877. Abstracts may be submitted online, beginning February 1, 2007.

Keywords : IPC, Midwest Conference

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