| Posted by Peter Biocca on 08 January 2007 at 10:01
|
 Tin–silver–copper has received much publicity in recent years as the lead–free solder of choice. The IPC Solder Value Product Council SAC305 (Sn96.5 Ag3.0 Cu0.5) was endorsed by as the preferred option for SMT assembly, and most assemblers have transitioned to this alloy for their solder paste requirements. However, due to the 3.0% silver content, the SAC305 is expensive when compared to traditional Sn63Pb37. For this reason, many wave assemblers are opting for less costly options, such as tin–copper based solders, for their wave, selective and dip tinning operations.
This article was taken from Global SMT & Packaging Vol. 6 No. 10 – November/December 2006.
Download the full article (free) in PDF format. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010. 