| Posted by Global SMT & Packaging on 01 December 2006 at 12:30
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As a result of the global transition to lead-free electronics, majority of the electronic component manufacturers are now using pure tin and tin-rich lead-free alloys for terminal and lead finishes. A major drawback of lead-free tin based finishes is tin whisker formation. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces, often in a needle-like form. These whiskers can bridge adjacent electrical conductors, causing the product to fail. Whisker related field failures have resulted in losses of over $1B since 1990.
Tin whisker studies are being conducted by various organizations all over the world, including consortia, universities, research organizations and companies. Whisker research includes examining the fundamentals of whisker growth, the influence of the plating process, the influence of materials sets, the environmental stress drivers, methods for estimating whisker failure risk, and strategies for mitigating whisker failure risk.
This two day symposium, held at the University of Maryland, will bring together international experts, in the field of tin whiskers to discuss the state of research on tin whiskers.
Topics
This symposium will cover whisker related failure case histories, theories of tin whisker growth, experiments and results, risk evaluation and mitigation strategies. Attendees will be presented with the current state of knowledge on the growth, risk and mitigation strategies, whereby they can develop effective qualification and mitigation procedures for their products.
Submissions
Participants are asked to submit presentation title and abstract prior to the presentation proposal deadline. Participants will be asked to send accepted presentations for print out and publication on the CALCE website prior to the presentation submission deadline. Please submit material via email to Dr. Michael Osterman, osterman@eng.umd.edu
Important Dates
January 26 Presentation Proposal Deadline
March 2 Acceptance Notification
April 2 Deadline for Registration
April 13 Presentation Submission Deadline
April 24-25 Symposium
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