| Posted by John H. Lau and Luo Dao Jun on 01 December 2006 at 11:12
|
 In the past few months, there have been many articles written on the China RoHS. Most of them, however, have been not only misstated but misleading. Of those that were correctly reported, few presented a complete picture of the China RoHS. In this study, the key differences between these two regulations will be critically reviewed. The principles, objectives, implementation methods, and backbones of China RoHS will also be briefly discussed. Furthermore, some important standards, such as marking and maximum concentration values (MCV), and the criterions for selecting the China RoHS product catalogue will be examined
This article originally appeared in Global SMT & Packaging magazine 6.9 - October 2006.
Download the full article (free) in PDF format. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 