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Competition Turns Up the Heat on Nokia

Nokia, which has led the cell phone market for years, is no longer at the top.

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What's New at National Electronics Week

Rebecca Galbraith reports from NEW.

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Wafer-level cavity package with via-through pad interconnects

The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical…

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Tools & Methods for Lean Production Management in EA

In spite of widespread understanding, however, the percentage of companies in the electronics assembly industry that actually 'live lean' within…

Video Newscast - June 26, 2008

This week on GSP Video News:
Hartner to head SMEMA Council; competition turns up the heat on Nokia; what's new at National Electronics Week; Foxconn lands the iPhone 3G contract; Foxconn not a high tech enterprise in China?; EBSO releases new ceramic singulating machine; JTAG breaks barrier between functional test & boundary scan; SEMI teams up with Messe Muenchen at Intersolar. Watch the news now.
Breaking News
Molex expands Flex Circuit capabilities with Aflextech, Inc. acquisition
Friday, 04 July 2008

AFlextech Inc., which was founded in 2003, has sales of approximately $25 million and has 300 employees.

 
Indium Corporation Receives Quality Award
Friday, 04 July 2008

(L to R) Michael Qiu and Andy MackieHeadquartered in Dallas, TX, with facilities in North America, Asia, and Europe, the company has achieved the Quality Awards of QS-9000, ISO-9001:2000, TS16949:2002 and ISO 14001 certifications.

 
BPM Appoints Distributor for Eastern Europe
Friday, 04 July 2008
An essential part of Etek Europe Ltd.’s philosophy is customer care and this has led the company to increase its engineering and refurbishment department.
 
MIRTEC Reports 81% Growth for First Half of Fiscal 2008
Friday, 04 July 2008

MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.

 
Austin Business Journal names agileTCP, One of Best Places to Work in Central Texas
Friday, 04 July 2008

Companies were selected based on employee ranking in such areas as team effectiveness, trust in senior leaders, feeling valued, trust with co-workers, and satisfaction with current roles.

 
You're invited to the Kulicke & Soffa Press Luncheon during SEMICON West 2008
Friday, 04 July 2008
Join us for an informal press lunch with Kulicke & Soffa & our senior management team!
 
Seasoned Manufacturing Veteran Tim Kardish Joins APS Novastar
Friday, 04 July 2008

New CEO focused on launching growth initiatives at the company

 
Metrologic Builds on Acquisition of Hand Held Products, Adds Global Expertise, Technology
Friday, 04 July 2008
Honeywell acquires Metrologic Instruments; Expands growing laser, Imaging and enterprise mobility business
 
BPM Appoints Distributor for Turkey
Thursday, 03 July 2008
Esman engineers train customers’ engineers and teach them the operation, process and maintenance of the machines.
 
Call for Papers: European Electronics Assembly Reliability Summit
Thursday, 03 July 2008

 Soldertec Global and Global SMT & Packaging magazine are delighted to announce a European and international conference on reliability in electronic assemblies.

 
Dage to exhibit Quick View CT inspection system at Semicon West
Thursday, 03 July 2008
Dage will exhibit its new Quick View CT inspection system at the Semicon West show in San Francisco, California on July 15-17, 2008
 
Blue Thunder Introduces Black ESD Conscious Nitrile Glove
Thursday, 03 July 2008

Blue Thunder Technologies Inc., announces its nitrile glove.

 
Practical Components Now Supplies the Latest FusionQuad™ (VQFP / HVF-PQFP) Dummy Component
Thursday, 03 July 2008
FusionQuad™ not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
 
Solving Counterfeit Components - The Problem, Identification & Testing Workshop
Thursday, 03 July 2008

Wednesday 10th September St Albans, Hertfordshire
Workshop starts at 10.00am with coffee from 9.30am. The event should conclude at 4.30pm
Book now as places limited to first 30 www.smartgroup.org/pdf/contcomponents.pdf

 
Dynasil Completes $20 Million Acquisition of RMD Instruments
Wednesday, 02 July 2008

Former RMD owners Dr. Gerald Entine and Mr. Jack Paster are now major Dynasil shareholders and will stay with the company. 

 
Daleba strengthens technical & quality teams in China
Wednesday, 02 July 2008
Andrew Grisbrooke, Director of the TCL GroupPart of the continually expanding TCL Group, Daleba boasts its own manufacturing facilities in Hertford as well as factories based within the Far Eastern Shenzhen and Guang Dong province.
 
Dow Corning's XR-1541 E-Beam Photoresists Take Aim at Next-Generation Lithography Processing
Wednesday, 02 July 2008
New High-Resolution Resists Enable Maskless Lithography Systems to Produce Features as Small as 6 nm
 
Sonoscan Launches HiRes Generation THRU-Scan™
Wednesday, 02 July 2008
HiRes Generation THRU-Scan™ significantly enhances through-transmission imaging with Sonoscan’s C-SAM® line of acoustic microscopes.
 
Levent Karaagac joined Esman Electronics as Assistant General Manager
Wednesday, 02 July 2008
His intention is to bring added value to Esman and our valued partners on the supplier and customer side.
 
New GM for UK Sales at Electrolube
Wednesday, 02 July 2008
New GM for UK Sales at Electrolube - Robert Crosby-ClarkeElectrolube, the electro-chemicals manufacturer, is delighted to announce the promotion of Robert Crosby-Clarke to General Manager of UK Sales.
 
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Featured Interview

Interview: Albert Bokma, Assembleon
When it comes to high-end chipshooters for high volume applications, Assembléon is one of the first names that springs to mind.
 

Small Matters

Change in the electronics industry – slow but inevitable

Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly.

 

Lead-Free Matters

Ball grid array & lead-free assembly defects, part 1

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.

 

Global Business

Challenging times ahead...

Component orders may be exceeding end market demand.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff