This week on GSP Video News: Hartner to head SMEMA Council; competition turns up the heat on Nokia; what's new at National Electronics Week; Foxconn lands the iPhone 3G contract; Foxconn not a high tech enterprise in China?; EBSO releases new ceramic singulating machine; JTAG breaks barrier between functional test & boundary scan; SEMI teams up with Messe Muenchen at Intersolar. Watch the news now.
Headquartered in Dallas, TX, with facilities in North America, Asia, and Europe, the company has achieved the Quality Awards of QS-9000, ISO-9001:2000, TS16949:2002 and ISO 14001 certifications.
An essential part of Etek Europe Ltd.’s philosophy is customer care and this has led the company to increase its engineering and refurbishment department.
MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Companies were selected based on employee ranking in such areas as team effectiveness, trust in senior leaders, feeling valued, trust with co-workers, and satisfaction with current roles.
Soldertec Global and Global SMT & Packaging magazine are delighted to announce a European and international conference on reliability in electronic assemblies.
FusionQuad™ not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Wednesday 10th September St Albans, Hertfordshire
Workshop starts at 10.00am with coffee from 9.30am. The event should conclude at 4.30pm
Book now as places limited to first 30 www.smartgroup.org/pdf/contcomponents.pdf
Part of the continually expanding TCL Group, Daleba boasts its own manufacturing facilities in Hertford as well as factories based within the Far Eastern Shenzhen and Guang Dong province.
Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly.
Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.