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6.9 - October 2006 PDF Print E-mail
 

Posted by Global SMT & Packaging on 13 October 2006 at 16:04

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Issue 6.9 / October 2006

- Editorial -

 

RoHS is here, but is it working?
Trevor Galbraith

 

- Technology Focus -

 

Key differences between EU RoHS and China RoHS
John H. Lau

Step stencils
William E. Coleman Ph.D. and Michael R. Burgess

 

Improved BGA shock and bend performance using corner glue epoxies
Michael Kochanowski, Brian Tolen

 

- Special Features -

Dr. Steven K. Case interview - CyberOptics

Product focus: ICON Technologies’ fully automatic screen printer


- Regular Columns -

Printed circuits, the next generation – going back to the future (North American edition)
Joe Fjelstad

Solder joint inspection: LEADOUT photolibrary on the road (European edition)
Bob Willis

Moderate slowdown following fall busy season
Jon and Walt Custer

Printed circuit board reliability: Loss of life during soldering
Werner Engelmaier

- Other Regular Features -

Industry News
New Products
Association News
International Diary

 

   
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Keywords : RoHS, Step stencils, BGA shock and bend, glue epoxies


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