Global SMT & Packaging magazine - 6.8  Alternative technologies for leadfree defluxing

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6.8 – Alternative technologies for lead–free de–fluxing

Posted by Michael T. Konrad on 13 October 2006 at 15:22

There are several steps in determining IF and HOW to implement a de-fluxing strategy. Lead-free soldering and reflow environments mandate a more critical de-fluxing due-diligence process.

The first thing one must consider is whether or not to clean. Is the flux left on the board after reflow inert? Is the appearance of the assembly important to the end-user? Will there be liability issues if the board fails due to the presence of flux residues? How important is the assembly’s reliability?

This article originally appeared in Global SMT & Packaging magazine 6.8 - September 2006.

Download the full article (free) in PDF format.

Keywords : batch cleaning, flux residues, lead-free, de-fluxing

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