The transition to lead-free solder technology presents a long list of challenges for the manufacturing shop floor engineers, and that list includes an array of cleaning challenges. This paper details the range of challenges from maintenance cleaning, screen cleaning, both on- and off-line, as well as assembly and package cleaning for high-reliability manufacturers. 

This article originally appeared in Global SMT & Packaging magazine 6.8 - September 2006.

Download the full article (free) in PDF format. 

Keywords : cleaning technology, lead-free, aqueous cleaning, semi-aqueous cleaning, vapor degreasing

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