• Investigation and development of tin–lead and lead–free solder pastes to reduce head–in–pillow defects by Jasbir Bath and Roberto Garcia, Christopher Associates Inc., and Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh, Koki Solder
• China’s export trade for gray–market handsets by Kevin Wang, iSuppli
• Combating counterfeit components—industry initiatives for a global problem by Nigel Burtt, Enjaybee Associates 

And more!

9.11 – November 2009

• Safe detection of hidden faults – Jens Kokott, GOEPEL electronic
  
• Reducing copper dissolution in lead–free assembly – D. Di Maio, C. P. Hunt and B. Willis
  
• Collaborative cleaning process innovations from managing experience and learning curves – Mike Bixenman, DBA and Dirk Ellis, Kyzen Corporation, and John Neiderman, Speedline Technologies

and more! 

• What you need to know before buying your AOI solution by Paul Groome, Machine Vision Products
• Which tools are best for SMT rework—conduction or convection? by Paul Wood, OK International
• Business process management for improved productivity and customer satisfaction by Maths E. Andersson, Elcoteq
  

9.9 – September 2009

• PoP (package on package) and vapor phase technology—Dan Coada, EPIC Technologies
• A baseline study of stencil and screen print processes for wafer backside coating—Jeff Schake, DEK USA, Inc.
• Special Packaging Feature—Imbedded Component/Die Technology: Is it ready for mainstream design applications?—Casey H. Cooper, Mark T. McMeen and Jim D. Raby, STI Electronics, Inc.

And more!

9.8 – August 2009

• "Establishing a precision stencil printing process for miniaturized electronics assembly" by Chris Anglin, Indium Corporation
• "Moving AOI beyond the grey world" by Shoich Rashed, Marantz Business Electronics Europe
• "Solder joint reliability: acceleration transforms and acceleration factors" by Werner Engelmaier
  

9.6 – June 2009

• "RoHS war stories" by Bev Christian, Research In Motion, and Michael Fry, Intertek Ageus Solutions
• "Energy measurement: The main metric for high strain rate bond testing of solder balls" by Dr. Stephen Clark, Dage Precision Industries
• "A revolution in wave soldering" by Peter Grundy, ITM Consulting

9.7 – July 2009

• "Metal–based wafer level packaging" by Shari Farrens, Ph.D., SUSS MicroTec
• "Cost reduction of wafer level packaging by using established materials from non–electronics industries" by Giles Humpston, Tessera
• "Case Study: Reducing recall risk down to no more than three PCB panels"

• "EMS ‘Lean Sigma’ shortens cycle time, reduces costs & improves quality" by Maths E. Andersson, Elcoteq, Luxembourg
• "Jetting fluids in non–traditional packaging and assembly applications" by Alec J. Babiarz, Asymtek, Carlsbad, CA, USA 
• Cleaning chemistry vs. mechanical impingement

In this issue: 

• Hot air solder leveling in the lead–free era 
  Keith Sweatman, Nihon Superior Co., Ltd
  
• Vapor phase vs. convection reflow in RoHS–compliant assembly
  Dan Coada, EPIC Technologies
  
• Conquering SMT stencil printing challenges with today’s miniature components
  Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.

And more! 

• iNEMI project evaluates BFR–free PCB materials
  Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
• PoP: An EMS perspective on assembly, rework and reliability Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell and Roden Cortero
• Efficient line changeover: the key to lean manufacturing
  Douglas Farlow