The idea of monitoring manufacturing processes using statistical methods goes back to the 1920s when Walter A. Shewhart, an American physicist, engineer and statistician, was engaged by the Western Electric Company in Chicago to find a way to produce their products with a certain quality level. 

The trend towards ever smaller components and more function density continues unabated in the SMT field.

Scientific exploration often requires the need to work with extraordinary technologies. Therefore, universities and research institutes require SMD production machines with a very large application range that allow the highest quality production, especially with small series.

Few things strike more dread in the hearts of technical service personnel than the words "Is your flux compatible with material 'XYZ'?"

Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer-driven product performance requirements.

As the first process step in an SMT production line, solder paste printing is of key importance. 

In part two of the series, other factors, such as board metallization, component finish metallization, mixing of alloys and their effect on the IMC formation, are highlighted in detail.

The continuing trend for the miniaturisation of portable electronic devices, combined with the demand for ever-greater functionality from those devices, has driven many surface mount designers away from the traditional SMT leaded package selections of PLCC, QFP, TSOP etc, and towards packages with an area grid array footprint.

Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies.

Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it.