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SUSS MicroTec Strengthens Presence in Asia with New Sales Structure PDF Print E-mail
Friday, 03 July 2009

With the appointment of ZMC Technologies as general sales representative for Malaysia, Singapore and Philippines, SUSS MicroTec reinforces its strong presence in Asia.

 
Mouser Electronics First to Stock the Freescale Tower System PDF Print E-mail
Thursday, 02 July 2009
Freescale TowerTWR-MCF51CN-KIT simplifies configuration with modular hardware development platform
 
Mesago Messe Frankfurt terminates collaboration with Automation Shanghai – IAC, TME + SENSOR PDF Print E-mail
Thursday, 02 July 2009
After one year of common commitment, there was no unity regarding the further design of the event.
 
Synopsys MVSIM adopted for low power verification of STw8500 mobile SoC platform PDF Print E-mail
Thursday, 02 July 2009
Comprehensive support for low power techniques and high level of accuracy significantly improve bug detection
 
Aquantia deploys Synopsys IC Validator and IC Compiler for 40nm quad 10GBASE-T design PDF Print E-mail
Wednesday, 01 July 2009
In-Design physical verification key to accelerated manufacturing compliance
 
Future Horizons signs up Israeli representative PDF Print E-mail
Wednesday, 01 July 2009
Ben-Artzi brings an impressive track record within the semiconductor industry to the world’s leading independent semiconductor analyst house.
 
Maximum Process Control for SEHO Selective Soldering Systems PDF Print E-mail
Wednesday, 01 July 2009
Flux ControlThe new flux control system from Seho does not only monitor the function of the drop jet nozzle.
 
Orpro Vision appoints Elas as distributor for Hungary PDF Print E-mail
Tuesday, 30 June 2009
Elas, located in Budapest, Hungary, supplies production equipment and consumables for the SMT industry since 1991.
 
SIPLACE SX: Market introduction follows successful field tests PDF Print E-mail
Tuesday, 30 June 2009

Following the successful completion of the field tests, the new SIPLACE SX will become officially available as scheduled on June 29.This intelligent 12-nozzle head uses software to switch to the mode that’s most efficient for the current production requirements, making constant line reconfigurations a thing of the past.

 
Asymtek Sells Spectrum™ S-910N Dispensing System to DancoTech PDF Print E-mail
Tuesday, 30 June 2009

L to R: Thomas Tach Soerensen and Ulrik Nielsen of DancoTechDancoTech’s 11th Asymtek Dispensing System

 
KIC’s Brian O’Leary to Host an Encore Presentation Webinar on Profiling BGAs PDF Print E-mail
Tuesday, 30 June 2009
Brian O’Leary, Sales Manager - Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m.
 
Technology Forecasters Expands Internationally, Celebrates 22nd Anniversary PDF Print E-mail
Monday, 29 June 2009
Completing a year of client base and research expansion in EMEA, consulting firm TFI turns to Asia for next-level client services there
 
DENSO Names New President and CEO Of North American Headquarters PDF Print E-mail
Friday, 26 June 2009
As president and CEO of DIAM, Sekiguchi also will serve as chair of the Board of Directors for the North American DENSO Group.
 
Hungary Opening for Cookson Electronics PDF Print E-mail
Friday, 26 June 2009
David Crimp and Rick Ertman open new solder paste facilityNew Cookson Solder Paste Facility Unveiled
 
Techcon Systems Releases Industrial Certification for Cartridges and Components PDF Print E-mail
Friday, 26 June 2009
Techcon Systems certifies that its cartridges and components meet or exceed GSA and industry standards.
 
IMPORTANT REMINDER: Launch of new SIPLACE placement system on Monday, 29th June 2009 PDF Print E-mail
Friday, 26 June 2009

You will be able to experience the launch on-line and real time - a unique event, for a very unique placement system.

 
Microscan Launches New Web Site to Keep Pace with Growth PDF Print E-mail
Friday, 26 June 2009
The Web site is now available in nine languages.
 
Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development PDF Print E-mail
Thursday, 25 June 2009
Funding Helps Provider of Innovative Wet Deposition Processes for Through-Silicon Via 3D-Packaging Meet Continuing Growth in Demand
 
KIC’s Brian O’Leary to Host Upcoming Webinar on Profiling BGAs PDF Print E-mail
Thursday, 25 June 2009
Brian O’LearyThe topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
 
Pleasingly high demand for the X-ray inspection solution Y.Cheetah exceeds expectations PDF Print E-mail
Thursday, 25 June 2009
YXLON Y.CheetahCustomers’ decisions from the electronics, printed circuit board and automotive industries in favor of the diversely, flexibly deployable Y.Cheetah are based above all on the system’s easy operation.
 
Can Europe Cut Road Deaths in Half by Next Year? PDF Print E-mail
Wednesday, 24 June 2009
Many of these initiatives and discussions involve ADAS technologies, which include ultrasonic and camera park-assist, adaptive cruise control, lane departure warning and blind-spot detection systems.
 
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors PDF Print E-mail
Wednesday, 24 June 2009
Under the agreement, both companies will work closely to address customer demands for high-performance process solutions that support high-volume manufacturing with a competitive cost of ownership.
 
Spectral Response invests in Orpro Vision’s AOI solutions PDF Print E-mail
Wednesday, 24 June 2009
Orpro Vision, that recently acquired the European and American AOI business from Orbotech, supplies process control solutions for the electronics assembly industry in Europe, Africa, Israel and the Americas.
 
Necten represents Essemtec in Spain PDF Print E-mail
Wednesday, 24 June 2009

Necten's staffs already have many years of experience in SMT assembly and will now be trained on Essemtec's Products.

 
Functional Test Technology Partners PDF Print E-mail
Tuesday, 23 June 2009
Functional test technology partnership: Geotest and JTAG Technologies announce integrated system.Geotest and JTAG Technologies announce integrated system
 
Can You Pass Up a 30% Cost Savings on Your Assembly Bonding Process? PDF Print E-mail
Monday, 22 June 2009
Kyle Rhodes and Virginia Read, Market Segment Managers of DYMAXThe webinar features DYMAX Market Segment Managers Virginia Read and Kyle Rhodes and includes cost savings evaluations and calculations.
 
Opportunities for Nanomaterials as Conductive Coatings PDF Print E-mail
Monday, 22 June 2009
While negligible in 2009, NanoMarkets expects sales of conductive coatings using nanomaterials to reach more than $625 million by 2016.
 
Manncorp includes inspection conveyor & feeder package with dual-head MC-391 pick & place PDF Print E-mail
Monday, 22 June 2009
For a very limited time, a feeder and inspection conveyor package valued at $20,470 is being included at no additional charge with Manncorp’s MC-391 dual-head pick and place system. This bonus offer, effective through July 31, is the equivalent of a discount of almost 30% off the $69,995 Internet price of this machine!The bonus offer, effective through July 31, is the equivalent of a discount of almost 30% off the $69,995 sale price of the standard machine without the bonus options, reports CEO Henry Mann.
 
Quatech’s upgraded airborne enterprise-class external ethernet bridges are now shipping PDF Print E-mail
Friday, 19 June 2009

The Airborne Wireless Ethernet Bridge allows Ethernet enabled devices to connect to a high performance wireless 802.11 network.

 
Synopsys and Actel renew OEM relationship for FPGA design software PDF Print E-mail
Friday, 19 June 2009
Synopsys and Actel renew OEM relationship for FPGA design software Technology leading FPGA tools deliver highly optimised results to designers using Actel FPGAs
 
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