An independent, international judging panel will include representatives from companies, trade bodies and academia as well as editors from the magazine. Entries in all categories will be judged on their relative merits such as commercial success, technical innovation and support of their staff.
The categories for 2008 are:
Adhesives/coatings/encapsulants
Isotropic and anisotropic conductive and non-conductive adhesives, water and solvent based conformal coatings and polymer based encapsulants.Assembly tools
Workstations, hand-tools, trolleys and carts etc.Best Asian product
Best of the new technologies developed in Asia.Best European product
Best of the new technologies developed in Europe.Best North American product
Best of the new technologies developed in North America.Bonding equipment
Wire bonders, wedge bonders, die bonders and other types of bonding equipment used to attach the die to the substrate.Cleaning equipment
Batch and inline cleaners using aqueous, solvent based or ultrasonic cleaning methods.Cleaning materials
Water-based and solvent-based cleaning materials used in batch and inline production as well as aerosols and wipes and other cleaning materials used in the manufacture of printed circuit assemblies.Components
Passive and active components, connectors, batteries and transformers.Contract services
CEMs, ODMs and other EMS companies involved in the assembly or design and manufacture of printed circuit assemblies for a customer or third party client.Dispensing equipment
Manual, semi-automatic and automatic dispensers of adhesives, encapsulants and other interconnection materials.Environmentally friendly products/services
Products and service that contribute most towards cleaner air, working environments and safe disposal of effluents used in manufacturing.New Category! Flux
Flux chemistries.Hand soldering – rework & repair
Soldering/desoldering irons and stations and rework equipment.New Category! ID systems
ID systems manufacturing equipment and services.Inspection - AOI systems
Manual and automatic vision systems used for the inspection of printed circuit assemblies.Inspection - x-ray
All forms of manual, semi-automatic and automatic x-ray equipment used in the inspection of printed circuit assemblies.New Category! Placement equipment - high volume
For 2008, we've split the placement equipment up into two categories, to recognize the broad range of equipment available.New Category! Placement equipment - low/medium volume
For 2008, we've split the placement equipment up into two categories, to recognize the broad range of equipment available.Printing equipment
Manual, semi-automatic and automatic printing machines, used for wafer bumping or printing with thick-film screens or SMT stencils.Programming
Manual, semi-automatic and automatic device programmers for online and offline applications.New Category! Selective soldering systems
Selective soldering equipment.Software
CRM software systems used to monitor equipment performance and improve supply chain logistics.Soldering equipment
Wave soldering, vapour phase soldering machines and reflow ovens.Soldering materials
SnPb and Pb-free solders and other interconnection products used in the interconnection of components to the substrate.Test equipment
Paste inspection, ICT, Boundary Scan, Thickness Testers, Bond Testers, Functional Test and other forms of automated test equipment.Wafer level products
Materials and equipment for wafer-level packaging.Register your products or services today, either online or by fax or mail.
Registrations for the 2007 Global Technology Awards are now closed.
Copyright 2005-2007. All Rights Reserved.
Awarded by
GLOBAL SMT
& Packaging
The Global Assembly Journal
for SMT & Advanced Packaging Professionals
2008
awards will be
presented at
