Breaking News
Major PCB industry suppliers headed to IPC Midwest Conference & Exhibition
Thursday, 01 February 2007

The exhibition, targeted specifically at the electronics assembly and PCB manufacturing industries, will begin at 10 am on Wednesday, September 26 and run through 2 pm on Friday, September 28.

 
Vectron International completes acquisition of BiODE Inc.
Thursday, 01 February 2007

Strengthens Sensor & Advanced Packaging Group's acoustic wave-based sensor offerings, represents strategic building block for future growth.

 
Hynix upsets the DRAM market with remarkable Q4 performance
Thursday, 01 February 2007

Hynix Semiconductor Inc. pulled off a double upset in the DRAM market with a remarkable increase in shipments causing it to rise to the second rank for both the fourth quarter and for all of 2006, up from third previously, according to a preliminary ranking from iSuppli Corp.

 
SMTA call for abstracts
Thursday, 01 February 2007

Abstract submission is now open for the upcoming AIMS Harsh Environment Electronics Workshop and Successful Lead-Free/RoHS Strategies Conference events to be held in June.

 
New cleaner for assemblies with sensitive metal alloys
Thursday, 01 February 2007
Due to its mild formulation, VIGON A 250 shows excellent material compatibility with sensitive metal alloys especially for long exposure times.
 
Tessera signs definitive agreement to acquire Eyesquad
Thursday, 01 February 2007
Tessera expands its consumer optics offering with solid state auto-focus and optical zoom technologies.

 

 
Keithley recognized for outstanding customer satisfaction in semiconductor industry
Thursday, 01 February 2007
VLSI has awarded Keithley a five star rating among process diagnostics companies, the highest possible rating for overall customer satisfaction

 

 
National Semiconductor acquires leading-edge data converter developer xignal technologies
Thursday, 01 February 2007
Key technology and development expertise to accelerate nationals leadership position in high-speed data converters.

 

 
PPD-130 allows precision dispensing of dangerous or topic substances
Thursday, 01 February 2007
I&J Fisnar's peristaltic pump dispenser provides accurate and repeatable deposits while maintaining a clean and safe bench environment.

 

 
XJTAG goes global and appoints multiple distributors to meet demand
Thursday, 01 February 2007
Eight new distributors will provide the company with representation in 21 countries across Europe, the Far East, North America, the Middle East and Australasia.
 
Ultra-fast flow, reworkable CSP underfill is jet dispensible
Thursday, 01 February 2007

Emerson & Cuming's XE-1218 cures in 4 minutes at 110C and even faster at high temperatures. Also new: CE-3520-3 electrically conductive paste.

 
Cobar's Ineke Tiggelen-Aarden to present paper at APEX 2007.
Wednesday, 31 January 2007
The presentation, on better solder paste characterization for lead-free, is scheduled for Wednesday, February 21st at 1:30PM.

 

 
A.C.E. Production Technologies moves to larger facility
Wednesday, 31 January 2007

The move was prompted by unprecedented growth fueled by an increase in systems sales of over 500% in 2006, according to Al Cable, President.

 
Modular Automation seeks to helps level the playing field between east and west
Wednesday, 31 January 2007
How can British manufacturers compete against the ever increasing march of eastern domination?

 

 
IME develops advanced RF CMOS chip
Wednesday, 31 January 2007
The Institute of Microelectronics (IME) has once again broken new grounds in its development of RFID solutions with the demonstration of a silicon chip that enables low cost UHF (Ultra High Frequency) RFID reader/writer modules.
 
KIC wins VISION award for KIC Vision
Wednesday, 31 January 2007
KIC VISION is an automatic profiling system at the price of a manual profiler.

 

 
Milara receives coveted industry award for its bumping system
Wednesday, 31 January 2007
Milara Inc., vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, has been awarded a SMT VISION Award in the category of Printing Equipment for its innovative AWPb 300 Automatic Wafer Bumping System.
 
New desktop electroplating system for in-house prototyping
Wednesday, 31 January 2007
This table-top system is specially designed for the professional production of prototypes and small batch production PCBs.
 
Dage Precision Industries David Bernard at APEX Process Clinic
Wednesday, 31 January 2007

Dr. Bernard will offer free and unbiased technical advice to help visitors with common process problems, RoHS compliance issues and field failure analysis. 

 
EFD and Leister Technologies to hold laser soldering webinar
Wednesday, 31 January 2007

EFD Inc.'s Solder Paste Group and Leister Technologies LLC will be holding a webinar entitled "An In-Depth Look at Laser Soldering" on March 6, 2007.

 
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Results 1 - 20 of 726

Featured Interview

6.10 - Pierre de Villemejane Interview
On Wednesday, November 8th the industry was rocked by yet another surprise acquisition.
 

Small Matters

6.10 - Should old technology be forgot: Reincarnation of past IC packaging solutions

One of the pleasures of staying involved in a technology for any length of time is that you occasionally get the opportunity to see second chances given to concepts and ideas that could not get traction in earlier incarnations. In the arena of electronic interconnections, this is not all that uncommon.

 

Lead-Free Matters

6.10 - Lead-Free Component Removal
For many years my preferred method of component removal for passive and small active rework has been a hot air pencil, and it can still be very effective.
 

Global Business

Market Report: 2006 status & 2007 outlook

Based upon 3Q06 financial data from a broad range of companies in the global electronics food chain, we now have an updated, quantitative picture of 2006 business conditions.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff










Newsflash

NEPCON WORLD JAPAN runs next week
Asias Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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Soldertec Lead-Free Reflow Soldering Interactive CD-ROM
Soldertec Lead-Free Reflow Soldering Interactive CD-ROM
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