Technology Focus
6.2 - Surface mount solder ball assembly PDF Print E-mail
Written by Global SMT & Packaging   
Wednesday, 01 February 2006
By using exclusively licensed, patent-protected techniques developed in conjunction with Novatec, Europlacer�s feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process.
 

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NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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