Interviews from the show floor PDF Print E-mail
Wednesday, 11 October 2006

On day two of ATE 2006, Global SMT & Packaging's editor-in chief, Trevor Galbraith, took to the floor with a camera crew to talk with key representatives of just a few suppliers about the latest technologies and breakthroughs in solder and cleaning materials. 


'Kyzen' means 'continuous improvement'
Kyzen's Tom Forsythe and Mike Bixenman talk about the philosophy of continuous improvement, the impact of miniaturization on the cleaning process, and how to find a tailor-made chemistry that is right for your application. Watch the video.




AMTECH unveils versatile new paste
AMTECH Solders is launching a revolutionary new solder paste�LF-4300�that is suitable for use with both lead-free and tin-lead alloys. We talked to their technical support manager, Gilbert Roberge, to get the scoop on this VOC- and halide-free, water soluble solder paste. Watch the video.



Indium works relentlessly toward reliability solutions

Indium's Rick Short takes time out during ATE to talk about some of the unique solutions their new reliability program has produced for plated-through-hole processes, power RF and microwave applications, HDI routing, lead-free CSP applications and more. Watch the video.


Siemens launches D-Series into US market

Mark Ogden and Tom Foley introduce the machine series that will replace the HS and HF series. The Siemens team discuss "virtual product build" and how the D-Series, which was designed to meet specific customer challenges, can offer a better ROI in a high-mix environment. Watch the video.

Look for video show reports and interviews from all of the major shows that Global SMT & Packaging attends in 2007.

 










Newsflash

NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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