7.1 - January 2007 PDF Print E-mail
Monday, 08 January 2007

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Issue 7.1 -  January 2007

- Editorial -

Glorious, colourful India!
Trevor Galbraith

- Technology Focus -

Ten lessons learned in cleaning Pb-free flux residues
Mike Bixenman, Erik Miller and Fernando Rueda

Characterizing mechanical stress
Soeren Hirsch, Soeren Majcherek and Bertram Schmidt

Low-warpage molding compound development for array packages
Irving Y. Chien, Jack Zhang, Lou Rector and Michael Todd

XRF - A reality check
Sia Afshari and W.J. Hall

- Business Feature -

Does lean manufacturing really save money?
Todd Baggett

- Special Features -

Pat Tripple interview - Henkel

IPC Expo/APEX/Designers Summit 2007 preview

Product focus: Permalex squeegee products improve the SMT printing process

- Regular Columns-

MAP 2006 and IWLPC 2006 conferences reviewed (NA edition)
Joe Fjelstad

Ball grid array mirror image design (EU edition)
Bob Willis

2006 status & 2007 outlook
Jon and Walt Custer

How to specify reliable PCBs for lead-free solder assembly, part 2
Werner Engelmaier

Lead-free solder alloys
Dongkai Shangguan

- Other Regular Features -
Industry News
Association News
International Diary

 










Newsflash

NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 
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