6.6 - June/July 2006

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Issue 6.6 / June/July 2006

- Editorial -

Business good but attendance poor at UK's leading show
Trevor Galbraith

- Technology Focus -

Standardizing cleanliness criteria for fiber optic connectors cuts costs, improves quality
Tatiana Berdinskikh, Sun-Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang

Fine pitch component self-alignment with Sn/Pb and Sn/Ag/Cu solders
Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sj�berg

Conductive adhesives and nanotechnology - alternatives for lead-free soldering
Frank Liotine, Jr.

 

- Special Features -

Tom Bernhardt interview (Panasonic)

SMT/Hybrid/Packaging 2006 - Review

 

- Regular Columns -

Impact of emissions from soldering processes (European edition)
Bob Willis

Reasoning with RoHS (North American edition)
Joe Fjelstad

Nonfunctional lands: keep vs. remove them
Werner Engelmaier

2006 outlook improves
Jon and Walt Custer


- Other regular features -

Industry news
Appointments
Association news
International diary

 
 










Newsflash

NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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