6.5 - May 2006

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North American Version PDF

Issue 6.5 / May 2006

- Editorial -

China begins to mature?
Trevor Galbraith

- Technology Focus -

IC package qualification testing for lead-free soldering
Vern Solberg

Thermal process optimization provides reduced energy consumption
Piotr Kanica

High performance flip-chip packages with copper pillar bumping
Joachim Kloeser, Ernst Weissbach

- Special Features -

NEPCON Shanghai show report (North American edition)

Book reviews - Bob Willis reviews the latest industry publications

SMT/Hybrid/Packaging 2006 - Preview (European edition)

- Regular Columns -

LEADOUT � benchmarking of the soldering process (European edition)
Bob Willis

IC package innovations (North American edition)

Joe Fjelstad

A �stable� 2006 � all things considered
Jon and Walt Custer

Surfacing lead-free issues in North America and Asia (European edition)
Alan Rae

Voids in solder joint reliability (North American edition)
Werner Engelmaier

- Other regular features -

Industry news
Association news
International diary



NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....

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