6.4 - April 2006

Download the full magazine as a PDF for FREE:

European Version PDF

North American Version PDF

Issue 6.4 / April 2006

- Editorial -

Where is the world taking us?
Trevor Galbraith

- Technology Focus -

Single ball reballing and repair of BGA components
Robert V. Avila

Maximizing the 'value-add' of the electronic materials partner
George A. Toskey

Fact and fiction of lead-free soldering
Keith Sweatman

Why solder spikes form
Yoshinobu Anbe


- Special Features -

George Szekeley Interview - TYCO Electronics

- Regular Columns -

Stencil board options and board wash-offs (European edition)
Bob Willis

The unaccounted cost of the lead-free mandate
Joe Fjelstad

Clear signs of normal seasonal slowdown
Jon and Walt Custer

Further study needed on backward compatability
Dongkai Shangguan


- Other regular features -

Industry news
Appointments
Association news
International diary

 
 










Newsflash

NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

Featured Products

Soldertec Lead-Free Reflow Soldering Interactive CD-ROM
Soldertec Lead-Free Reflow Soldering Interactive CD-ROM
$199.00
Add to Cart

Printed Board Circuit Design & Lead-Free Defect Guide
Printed Board Circuit Design & Lead-Free Defect Guide
$199.00
Add to Cart

Canisportivi.com | Wow-powerleveling-wow.com | Discountairmaxstore.com | Tipsteradvice.com | Zynetwc.com | Peace-tattoo.com | Afreecodecvt.com | Cercainveneto.com | Mega-articles.com