6.3 - March 2006

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Issue 6.3 / March 2006

- Editorial -

APEX 2006 - Flying High
Trevor Galbraith

- Technology Focus -

Advances in jetting small dots of high viscosity fluid for electronic and semiconductor packaging
Alec J. Babiarz

Printing the electronic future
Dr Peter Harrop

- Special Features -

Global Technology Awards - winners profiles
Pat Flynn Interview - ECT Technologies Inc.

- Regular Columns -

Design for manufacturing in global outsourcing environment (North American edition)
Dongkai Shagguan

System design reconsidered
(North American edition)
Joe Fjelstad

Solder spots - a new plague in manufacture?
Bob Willis

4 '05 - financials confirm robust global growth
Jon and Walt Custer

Reliability improvement with underfills
Werner Engelmaier

- Other regular features -

Industry news
Association news
International diary



NEPCON WORLD JAPAN runs next week
Asia�s Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....

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