Technical Articles
7.1 - Low-warpage molding compound development for array packages
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Written by Irving Y. Chien, Jack Zhang, Lou Rector and Michael Tod   
Wednesday, 07 February 2007
Due to the singulation and soldering processes required during package assembly, device warpage after molding is a critical issue for array packages.
 
7.1 - Characterizing mechanical stress caused by packaging processes
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Written by Soeren Hirsch, Soeren Majcherek & Bertram Schmidt   
Wednesday, 07 February 2007

This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.

 
7.1 - Ten lessons learned in cleaning Pb-free flux residues
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Written by Mike Bixenman, Erik Miller and Fernando Rueda   
Wednesday, 07 February 2007

When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.

 
White paper: Bumping BGAs using solder paste printing process for RFI shields packaging
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Written by Dr. Gerald Pham-Van-Diep, Srinivasa R. Aravamudhan, Joe Belmonte1, Dr. Benlih Huang   
Friday, 26 January 2007
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of snapping the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.
 
White Paper: Defluxing of eutectic and lead-free assemblies in a single cleaning process
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Written by Wack, Schweigart, Tosun, Becht, Afshari and Ellis   
Friday, 26 January 2007
As the entire electronic manufacturing industry braced for the July 1, 2006 deadline, it has been reevaluating the entire production process.
 
White Paper: Effects of Cooling Slopes in Lead Free Reflow
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Written by Marc Apell, Tad Formella and Alden Johnson, Speedline Technologies, Inc.   
Friday, 26 January 2007

As more electronic assemblers move to lead free SMT production, concerns are raised over reflow cooling slopes and effects on solder joints.

 
6.10 - Tin-copper based solder options for lead-free assembly
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Written by Peter Biocca   
Monday, 08 January 2007
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice.

 

 
6.10 - Inventory management: combining business intelligence & material handling hardware
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Written by Bob Douglas   
Monday, 08 January 2007
Most business intelligence (BI) tools and supply chain management (SCM) applications address inventory issues from either a software perspective or a material handling perspective;.
 
6.10 - Delidding ICs to verify chip authenticity
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Written by Joel Deutsch   
Monday, 08 January 2007

Rampant counterfeiting in regions such as Asia has made strict research into the documentation and authenticity of chips an essential prerequisite for accepting ICs for integration into manufactured products.

 
6.9 - Key differences between US RoHS and China RoHS
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Written by John H. Lau and Luo Dao Jun   
Friday, 01 December 2006
In the past few months, there have been many articles written on the China RoHS. Most of them, however, have been not only misstated but misleading. Of those that were correctly reported, few presented a complete picture of the China RoHS.
 
6.9 - Improved BGA shock and bend performance using corner glue epoxies
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Written by Michael Kochanowski and Brian Toleno   
Friday, 01 December 2006
The adoption of lead free solders has decreased the reliability of BGA packages subjected to shock and bend events.
 
6.9 - Step stencils
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Written by William E. Coleman Ph.D. and Michael R. Burgess   
Friday, 01 December 2006

In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. However, as SMT requirements became more complex and, consequently, more demanding, so did the requirements for complex step stencils.

 
White Paper: RoHS compliance and Pb-free capability: One in the same?
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Written by Kevin Curran, the electronics group of Henkel   
Tuesday, 07 November 2006

Just because a material is free of the RoHS list of excluded substances, doesnt mean it can withstand processing at the elevated temperatures of lead-free.  

 
White Paper: Tin Whiskers
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Written by Speedline Technologies   
Wednesday, 25 October 2006

This white paper addresses six questions relating to the phenomenon of tin whiskers.

 
White Paper: Self-centering of offset chip components in a Pb-free assembly
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Written by Amey Teredesai, Srinivasa Aravamudhan, Joe Belmonte, Richard Szymanowksi   
Wednesday, 25 October 2006

One area of interest that requires additional experimentation and understanding is the ability of the Pb-free alloys to self-center offset components compared to the Sn/Pb alloy.

 
White Paper: Accuracy improvements for the dispensing operation
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Written by Brian Prescott, Speedline Technologies   
Wednesday, 25 October 2006

Typically, dispensing platform specifications do not include the error associated with positional mechanisms, which greatly contributes to final accuracy and repeatability.

 
6.8 - Rework system-to-system performance characterization
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Written by Al Cabral   
Friday, 13 October 2006

This paper describes a practical approach to characterizing the thermal performance of similarly configured rework systems, with the aim of yielding like thermal performance.

 
6.8 - Alternative technologies for lead-free de-fluxing
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Written by Michael T. Konrad   
Friday, 13 October 2006

There are several steps in determining IF and HOW to implement a de-fluxing strategy. Lead-free soldering and reflow environments mandate a more critical de-fluxing due-diligence process.

 
6.8 - How to clean lead-free materials
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Written by Thomas M. Forsythe   
Friday, 13 October 2006

The transition to lead-free solder technology presents a long list of challenges for the manufacturing shop floor engineers, and that list includes an array of cleaning challenges.

 
White Paper: Fairy tales do come true: an SnPb paste capable of Pb-free temps
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Written by Steve Dowds, the electronics group of Henkel   
Tuesday, 19 September 2006

Just as Cinderellas 12:00 deadline turned her coach into a pumpkin in the famed childrens fairy tale, at midnight on June 30th all electronics manufacturing will magically transform to lead-free. Well, not quite.

 
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