Knowledge
7.1 - How to specify reliable PCBs for lead-free solder assembly, part 2
Written by Werner Engelmaier   
Wednesday, 14 February 2007
My original column on this topic, How to specify reliable PCBs for lead-free solder assembly, appeared in the September 2006 [GSMT&P 6.08] issue.
 
7.1 - Lead-free solder alloys
Written by Dr. Dongkai Shangguan   
Wednesday, 14 February 2007

For lead-free solder alloys, based on considerations for toxicity, cost and availability, manufacturability, and metallurgical, chemical, physical and mechanical properties, the worldwide industry has converged on to the Sn-Ag-Cu (SAC) eutectic alloy, based on earlier recommendation by iNEMI.

 
7.1 - MAP 2006 and IWLPC 2006 conferences reviewed
Written by Joe Fjelstad   
Wednesday, 14 February 2007
During the week of October 30th through November 3rd 2006, I had the good fortune to attend two excellent conferences, one in Asia the other in San Jose, California.
 
7.1 - Ball grid array mirror image design
Written by Bob Willis   
Wednesday, 14 February 2007

Over the last few weeks I have had a number of questions on the use of double-sided mirrored ball grid array (BGA) packages.

 
7.1 - Low-warpage molding compound development for array packages
Written by Irving Y. Chien, Jack Zhang, Lou Rector and Michael Tod   
Wednesday, 07 February 2007
Due to the singulation and soldering processes required during package assembly, device warpage after molding is a critical issue for array packages.
 
7.1 - Characterizing mechanical stress caused by packaging processes
Written by Soeren Hirsch, Soeren Majcherek & Bertram Schmidt   
Wednesday, 07 February 2007

This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.

 
7.1 - Ten lessons learned in cleaning Pb-free flux residues
Written by Mike Bixenman, Erik Miller and Fernando Rueda   
Wednesday, 07 February 2007

When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.

 
White paper: Bumping BGAs using solder paste printing process for RFI shields packaging
Written by Dr. Gerald Pham-Van-Diep, Srinivasa R. Aravamudhan, Joe Belmonte1, Dr. Benlih Huang   
Friday, 26 January 2007
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of snapping the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.
 
White Paper: Defluxing of eutectic and lead-free assemblies in a single cleaning process
Written by Wack, Schweigart, Tosun, Becht, Afshari and Ellis   
Friday, 26 January 2007
As the entire electronic manufacturing industry braced for the July 1, 2006 deadline, it has been reevaluating the entire production process.
 
White Paper: Effects of Cooling Slopes in Lead Free Reflow
Written by Marc Apell, Tad Formella and Alden Johnson, Speedline Technologies, Inc.   
Friday, 26 January 2007

As more electronic assemblers move to lead free SMT production, concerns are raised over reflow cooling slopes and effects on solder joints.

 
6.10 - Lead-Free Component Removal
Written by Bob Willis   
Wednesday, 10 January 2007
For many years my preferred method of component removal for passive and small active rework has been a hot air pencil, and it can still be very effective.
 
6.10 - Should old technology be forgot: Reincarnation of past IC packaging solutions
Written by Joe Fjelstad   
Wednesday, 10 January 2007

One of the pleasures of staying involved in a technology for any length of time is that you occasionally get the opportunity to see second chances given to concepts and ideas that could not get traction in earlier incarnations. In the arena of electronic interconnections, this is not all that uncommon.

 
6.10 - The cheaters are back!
Written by Bob Black   
Wednesday, 10 January 2007

Dont look now, but those bad old days of Highly Exaggerated Placement Speeds on placement machines are back.

 
6.10 - Tin-copper based solder options for lead-free assembly
Written by Peter Biocca   
Monday, 08 January 2007
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice.

 

 
6.10 - Inventory management: combining business intelligence & material handling hardware
Written by Bob Douglas   
Monday, 08 January 2007
Most business intelligence (BI) tools and supply chain management (SCM) applications address inventory issues from either a software perspective or a material handling perspective;.
 
6.10 - Delidding ICs to verify chip authenticity
Written by Joel Deutsch   
Monday, 08 January 2007

Rampant counterfeiting in regions such as Asia has made strict research into the documentation and authenticity of chips an essential prerequisite for accepting ICs for integration into manufactured products.

 
6.9 - Solder joint inspection LEADOUT photolibrary on the road
Written by Global SMT & Packaging   
Tuesday, 12 December 2006

Inspection of lead-free joints has been a hot topic over the last few years, and now with staff trying to come to grips with real world pressure of interpreting good from bad, urgent support is necessary.

 
6.9 - Printed circuits, the next generation going back to the future
Written by Global SMT & Packaging   
Tuesday, 12 December 2006
Printed circuits are a fundamental element part of virtually all electronic assemblies and have been since their origins.
 
6.9 - Printed circuit board reliability: Loss of life during soldering
Written by Global SMT & Packaging   
Tuesday, 12 December 2006

It appears that the threat posed by lead-free soldering to the reliability of the interconnect structures of printed circuit boards (PCBs) is perhaps more significant than the as yet not fully understood threat to the reliability of the solder joints themselves.

 
7.1 - Prognostications 2006 to 2008
Written by Walt & Jon Custer   
Friday, 01 December 2006

Thanks to higher interest rates and other inflation-controlling efforts the worlds economies appear to be heading toward a soft landing in 2007

 
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Newsflash

NEPCON WORLD JAPAN runs next week
Asias Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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