Regular Columns

Jon & Walt Custer

Werner Engelmaier 

Joe Fjelstad

Alan Rae

Dongkai Shangguan

Bob Willis



7.1 - How to specify reliable PCBs for lead-free solder assembly, part 2 PDF Print E-mail
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Columns - Werner Engelmaier
Written by Werner Engelmaier   
Wednesday, 14 February 2007
My original column on this topic, How to specify reliable PCBs for lead-free solder assembly, appeared in the September 2006 [GSMT&P 6.08] issue.
 
7.1 - Lead-free solder alloys PDF Print E-mail
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Columns - Dongkai Shangguan
Written by Dr. Dongkai Shangguan   
Wednesday, 14 February 2007

For lead-free solder alloys, based on considerations for toxicity, cost and availability, manufacturability, and metallurgical, chemical, physical and mechanical properties, the worldwide industry has converged on to the Sn-Ag-Cu (SAC) eutectic alloy, based on earlier recommendation by iNEMI.

 
7.1 - MAP 2006 and IWLPC 2006 conferences reviewed PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Wednesday, 14 February 2007
During the week of October 30th through November 3rd 2006, I had the good fortune to attend two excellent conferences, one in Asia the other in San Jose, California.
 
7.1 - Ball grid array mirror image design PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Wednesday, 14 February 2007

Over the last few weeks I have had a number of questions on the use of double-sided mirrored ball grid array (BGA) packages.

 
6.10 - Lead-Free Component Removal PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Wednesday, 10 January 2007
For many years my preferred method of component removal for passive and small active rework has been a hot air pencil, and it can still be very effective.
 
6.10 - Should old technology be forgot: Reincarnation of past IC packaging solutions PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Wednesday, 10 January 2007

One of the pleasures of staying involved in a technology for any length of time is that you occasionally get the opportunity to see second chances given to concepts and ideas that could not get traction in earlier incarnations. In the arena of electronic interconnections, this is not all that uncommon.

 
6.10 - The cheaters are back! PDF Print E-mail
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Guest Columnists
Written by Bob Black   
Wednesday, 10 January 2007

Dont look now, but those bad old days of Highly Exaggerated Placement Speeds on placement machines are back.

 
6.9 - Solder joint inspection LEADOUT photolibrary on the road PDF Print E-mail
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Columns - Bob Willis
Written by Global SMT & Packaging   
Tuesday, 12 December 2006

Inspection of lead-free joints has been a hot topic over the last few years, and now with staff trying to come to grips with real world pressure of interpreting good from bad, urgent support is necessary.

 
6.9 - Printed circuits, the next generation going back to the future PDF Print E-mail
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Columns - Joe Fjelstad
Written by Global SMT & Packaging   
Tuesday, 12 December 2006
Printed circuits are a fundamental element part of virtually all electronic assemblies and have been since their origins.
 
6.9 - Printed circuit board reliability: Loss of life during soldering PDF Print E-mail
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Columns - Werner Engelmaier
Written by Global SMT & Packaging   
Tuesday, 12 December 2006

It appears that the threat posed by lead-free soldering to the reliability of the interconnect structures of printed circuit boards (PCBs) is perhaps more significant than the as yet not fully understood threat to the reliability of the solder joints themselves.

 
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Newsflash

NEPCON WORLD JAPAN runs next week
Asias Largest exhibition gathering equipment, components and materials for SMT & electronics manufacturing runs from Wednesday, January 17 through Friday, January 19 in Tokyo. Read more....
 

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